主選單

Wire Bonding Tools
- Miraido is committed to the research, development, and production of high-end domestic wire bonding tools in the IC packaging industry.
- In strategic collaboration with International RD teams, we develop high-strength, high-hardness, and high-precision wire bonding tools.
- We independently research and produce ceramic powders and blanks.
- Leading the industry with a fully automated production line.
- A full range of bonding tools for gold, silver, and copper wire applications.
- Providing cost-effective solutions for IC packaging bonding materials.

Key Dimensions
✔ 外徑 Outer Diameter(OD)
✔ 錐角 Cone Angle (CA)
✔ 瓶頸出口 Bottleneck Exit (BTNK E)
✔ 正面角度 Face Angle (FA)
✔ 尖端 Tip(T)
✔ 孔徑 Hole (H)
✔ 倒角直徑 Chamfer diameter (CD)

✔ 內倒角角度 Inner Chamfer Angle (IC A)
- Tip size ranges from 50 to 150 microns, with multi-size grinding processing using a diamond grinding wheel at the tip.
- The precision of Hole (inner hole) and CD (inner chamfer) dimensions is within 1–2 microns.
- With high-precision processing of ceramic materials, we have fully mastered the core technology of precision machining, ensuring all processed dimensions are highly consistent.

Bonder Tools Surface Treatment

Smooth surface
Gold wire
Textured surface
Silver wireGold wire
Rough textured surface
Copper wire

After the external dimensions of the bonding tools are processed, surface treatment is performed on the tool.
According to the application requirements of the bonding tool, it is divided into smooth surface, textured surface, and rough textured surface.
We have mastered the core technology of surface treatment, ensuring that the surface treatment is uniform, consistent, and stable between batches.

Miraido Production Process

Finished Processing

Miraido Product Part Number Structure