Mold Cleaning

Specialized products designed to maintain and enhance the efficiency of molds used in semiconductor manufacturing.




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    Primer adhesive

    • Effectively decompose mold contamination through the actions of cleaning die materials such as dissolution, encapsulation, and scraping.
    • Reduce the adhesion force of mold contamination on the mold surface through the use of cleaning agents and the like.

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    Mold release agent

    • Mold cleaning, to remove mold deposits from the surface of the mold, and restore the metal surface to a smooth and clean condition.
    • The adhesion of polymer materials solidifies to remove mold contamination from the mold surface.

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    Lubricating mold tape

    • Restore the mold’s release capability for the molding compound (demolding ability).
    • After mold cleaning, apply a release agent wax to the surface of the mold, forming a uniform layer of release agent coating.

    Performance Specification Sheet

    Key product features and applicable scope

    • Principle of washing mold with rubber strips

      The stain consists of two layers:

      First layer: Generated by the paraffin and inorganic substances contained in the laminating material (rainbow color)

      Second layer: 

      Produced by the components contained in the laminating material (yellowish-brown)


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      Cleaner contact with mold surface stains

      The cleaner contained in the release agent penetrates into and dissolves the stains on the mold.

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      Stains are adsorbed onto the surface of the mold release strip

      The dissolved stains are adsorbed onto the surface of the mold release strip by the adsorbent.

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      Curing of release rubber strips

      The rubber strips undergo crosslinking and solidification, which enhances their strength, toughness, and facilitates demolding.

      • Cleaning Evaluation of Molds After Cleaning


        Compound Type:

        EMME-G630AYMolding Shot before Cleaning: 100shots


        Mold Surface:

        A88/Cr-plating, Mirror Surface


      • Mold release parameters

        The test results showing the impact of cleaning time and cleaning modulus on cleaning effectiveness are as follows:

        Package Types: TO, SOT, SOP, QFP, BGA, EMME

        Temperature: 175°C, Pressure: 8-17 mpa,Time:450s.


      • cleaning modulus on cleaning effectiveness are as follows

        The cleaning time is determined by the condition of the mold surface.

        Severely contaminated molds: 600 seconds or increase cleaning cycles to 800seconds/cycle, with remarkable results.

        Moderately contaminated molds: 300 seconds.


      Suggested mold parameters

      Mold parameters suitable for the product, which can be adjusted according to specific usage requirements.



      Note: For Towa automatic molds, the recommended CLAMP position is set to 138.2~138.4 mm, at which point the CLAMP pressure will be indicated as 10~13 (units not specified, possibly MPa or kgf/cm², etc.).

      Suggested cleaning module

      Standard Priming/Cleaning/Lubrication Process for General Product Requirements




      Enhanced Cleaning Process for Plastic Encapsulation with Strict Appearance Requirements


      • Packaging and storage

        Packaging:

        Product Form: Flat sheet shape, cut into strip form, each piece comes with a separator film, net weight 10kg/box.

        Storage:

        1. Store in a cool and ventilated place, ideally with the packaging bag sealed and kept in an environment below 5℃. Place at room temperature for 1 hour before use.
        2. If the primer glue, mold release glue, and lubricating mold glue are left at room temperature for an extended period, the adhesive may solidify, affecting its fluidity. Therefore, it is recommended to use the product as soon as possible.
        3. The shelf life of the product is approximately 1 month at room temperature and can be extended up to 15days  when stored below 5℃.

      Product display

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          TF card


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          QFN


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          TO220F


          • Operational technical problem

            If the operating parameters are out of range, the following issues may occur:


            1. Insufficient diffusion (low pressure)
            2. Sticky mold in the cavity (high pressure)
            3. The cured rubber strip, after being subjected to high pressure, is difficult to demold (high pressure)

          Possible Issues 

          Mold Temperature

          Ejector Pin Pressure

          Curing Time

          Mold Ejector Pin Height

          Number of Cleaning Strips

          Cured Rubber Adhesion Issue

          Cured Rubber Corner Fragmentation Issue

          No Ejector Pin on the Upper Mold Issue

          Incomplete Curing Issue

          Cured Rubber Not Fully Filled Issue